Job Description

Job Description

Job Description

Company Description

Smiths Interconnect, is a global leader in the design and manufacture of high-performance interconnect solutions. Our products are used in mission-critical applications across industries such as aerospace, defense, telecommunications, and industrial markets. At Smiths Interconnect, we are committed to innovation, quality, and providing cutting-edge solutions that connect the world’s most demanding systems.

Smiths Interconnect is part of Smiths Group. For over 170 years, Smiths has been pioneering progress by engineering for a better future. We serve millions of people every year, to help create a safer, more efficient and productive, and better-connected world across four global markets: energy, security & defense, space & aerospace and general industrial. Listed on the London Stock Exchange, Smiths employs c.16,000 colleagues in over 50 countries. 

Work in an integrated process team environment, with technical responsibility for all of the following, regarding RF/microwave/mmW hardware: research, architecture trades, estimating recurring and non-recurring hardware and activities, analysis, proposals, selection, development, prototyping, verification, customer support, manufacturing support, and sustainment.

Responsbibilities:

• Have technical responsibility for all aspects of the RF/microwave/mmW hardware within our products, inclusive of UHF through 40GHz
• Participate in the entire product lifecycle for bespoke electronics modules, subsystems, and systems for the aerospace and defense market, including for RADAR, EW, SIGINT, comm, and satcom.
• Work in an integrated process team (IPT) environment, along with program management, quality, manufacturing, supply chain, and other engineering disciplines
• Perform all of the following activities for RF/microwave/mmW hardware: research, architecture trades, estimate recurring and non-recurring hardware and activities, analyze circuits, write technical proposals, select active and passive devices, design single layer substrates and single to multi-layer printed circuit boards, prototyping, verification, customer support, manufacturing support, and sustainment.

Technical Knowledge, Skills and Abilities:

Required:

• Competent in RF linear and non-linear circuit simulation using Cadence AWR or ADS
• Experience with 2.5D and 3D electromagnetic problems and simulation tools
• Experience with multi-layer printed wiring boards (PWB) design and layout up to 20 GHz
• Experience with single-layer duroid and ceramic layout up to 40GHz
• Experience with chip & wire/bare die design, interconnect, and modeling of interconnect
• Competent in analog DC, AC, and transient circuit simulation using SPICE or derivative
• Competent in RF measurements and design validation procedures

Preferred:

• Experience with MMIC development through 40GHz
• Knowledgeable of system architecture and block diagram planning of up converters and down converters
• Experience with RF system modeling using Cadence AWR VSS
• Knowledgeable of frequency planning and mixer spurious analysis for up and down converters
• Knowledgeable of phase noise requirements, cascaded phase noise performance, and connection to hardware implementation methods
• Knowledgeable with millimeter-wave electronics through 100GHz
• General knowledge of the requirements for and design of microwave sources, LNAs, SSPAs, mixers, filters, and synthesizers

Experience:

• 5 to 10 years of progressively increasing experience and responsibility for hardware development through at least 20GHz

Education:

• Bachelor’s Degree in Electrical Engineering (BSEE)

Travel:

• Up to 10 % required or as business needs require; predominately within continental U.S.

Security:

• Must be a US Citizen, with ability to hold US DoD security clearance

Why Smiths Interconnect?

• Global Impact: As part of Smiths Group, a global engineering leader, you’ll be working on ground-breaking technologies that make a difference in industries that are shaping the future.
• Career Growth: Opportunities for professional development and career progression across Smiths Interconnect and the wider Smiths Group.
• Innovative Culture: Join a collaborative and innovative team, where your ideas and contributions are valued and rewarded.
• Competitive Package: We offer a competitive salary, benefits package, and performance-related incentives.

We believe that different perspectives and backgrounds are what make a company flourish. All qualified applicants will receive equal consideration for employment regardless of race, colour, religion, sex, sexual orientation, gender identity, national origin, economic status, disability, age, or any other legally protected characteristics. We are proud to be an inclusive company with values grounded in equality and ethics, where we celebrate, support, and embrace diversity.

At no time during the hiring process will Smiths Group, nor any of our recruitment partners ever request payment to enable participation – including, but not limited to, interviews or testing. Avoid fraudulent requests by applying jobs directly through our career’s website (Careers - Smiths Group plc)

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